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The NGDR-07C / NGDR-07 / FF650R17IE4 ABB IGBT Module Kit is a high-voltage, high-current industrial power semiconductor solution based on the Infineon TRENCHSTOP™ IGBT4 (E4) technology platform, designed for robust and efficient operation in medium-to-high power conversion systems. The module integrates a 1700 V / 650 A PrimePACK™ 2 dual half-bridge IGBT configuration, optimized for high reliability, low switching losses, and superior thermal cycling capability.
| The ABB NGDR-07C NGDR-07 FF650R17IE4 features: |
| Electrical Performance Ratings | |
| Collector-Emitter Voltage (V_CES): | 1700 V |
| Nominal Collector Current (I_Cnom): | 650 A |
| Maximum Collector Current (I_Cmax): |
650 A |
| Junction Operating Temperature (T_vj op): | up to 150°C |
The NGDR-07C / NGDR-07 / FF650R17IE4 ABB IGBT Module Kit is based on a PrimePACK™ 2 half-bridge dual IGBT architecture, integrating IGBT4 (TRENCHSTOP™ E4) chips with a co-packaged fast recovery diode and NTC thermistor, enabling high-density power conversion in compact inverter systems.
The NGDR-07C / NGDR-07 / FF650R17IE4 ABB module exhibits a collector-emitter voltage rating of 1700 V (V_CES), achieved through field-stop trench IGBT cell engineering and optimized drift region doping profiles, ensuring robust avalanche immunity and high transient overvoltage tolerance.
The NGDR-07C / NGDR-07 / FF650R17IE4 ABB module supports a nominal collector current of 650 A (I_Cnom) through high-current density chip stacking, optimized emitter metallization, and low-resistance current spreading geometry, enabling efficient conduction in high-power drive systems.
The NGDR-07C / NGDR-07 / FF650R17IE4 ABB module minimizes switching losses via IGBT4 ultra-fast tail current suppression and diode softness optimization, resulting in reduced E_on, E_off, and reverse recovery energy (E_rec) during PWM operation in high-frequency inverter environments.
The NGDR-07C / NGDR-07 / FF650R17IE4 ABB module supports an extended junction temperature capability up to T_vj(op) = 150°C, enabled by copper baseplate heat spreading, low thermal impedance interfaces, and thermomechanically optimized solder layers.
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